Soft Encapsulation Material Package Circuit Has Good Results

In view of the fact that electronic enthusiasts currently use wax or bitumen as a sealant to protect circuits, but the effect is not good, the experts of the China Epoxy Resin Industry Association specifically proposed that the current universal epoxy resin and other four types of the best soft encapsulants There are very good results, such materials also include polysulfide, polyurethane, silicone.

The soft package does not require the use of a package housing for the mounting and protection of the integrated circuit chip. The packaging method is very simple and inexpensive, and has been widely used in some electronic watch circuits, electronic music circuits, and amateur electronic circuits. Among them, the epoxy resin encapsulant material has excellent properties such as insulation, chemical resistance, adhesion, etc., and has a low curing shrinkage of 2%, making it an ideal material for a soft package.