Mechanical parameters of fatigue strength of membrane-based interface

We used a dynamic bond strength tester to test the bond strength of six hard films prepared by plasma enhanced deposition. The bonding strength can be divided into three groups from low to high: the surface of the ground state has the lowest TiN bonding strength; sand blasting can increase the surface roughness of the substrate, increase the mechanical bond between the film bases; and form chromium, molybdenum and vanadium during nitriding. And the nitride of iron and TiN film have similar crystal structure and lattice constant, TiN can be epitaxially grown on these nitrides, the two samples have higher bonding strength; TiCN has the highest bonding strength due to TiCN lattice The constant is closer to the various types of carbides in the matrix, which facilitates the epitaxial growth of the film by non-spontaneous nucleation, which increases the metallurgical bond between the film substrates.

Although the thickness of the film layer or the hardness of the matrix is ​​different in the three groups, the film composition and the coating process are the same, and the interface state is similar. The test results reflect that the bond strengths of the three groups are basically the same, indicating that the results obtained by the method are not sensitive to matrix hardness and film thickness. The above analysis shows that the fatigue strength shear stress amplitude of the film-based interface measured by the contact fatigue method is sensitive to interface factors (such as film composition and substrate surface state) and non-interface factors (base hardness and film thickness). Mechanical parameters.

Discussion of the test method When the thickness of the film layer is small and the bonding strength is high, it is sometimes difficult to achieve the peeling of the film layer by simply increasing the load to increase the shear stress at the interface. According to the Hertz elastic contact theory, increasing the contact stress increases the contact radius, and although the maximum shear stress increases, it occurs in the matrix deeper than the surface, and the increase at the interface of the film base is not obvious.

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